ME 578 Introduction to Electronic Packaging
This course provides a foundation on mechanical and materials aspects of electronic packaging as well as an understanding of the fundamental mechanical principles used in the design of electronic packages, boards, sub-systems, and systems with focus on their integration. Topics include design, properties, materials, interconnections, assembly processes, performance of various packaging systems, thermal management, failure mechanisms and reliability.
Slash Listed Courses
Also offered for undergraduate-level credit as ME 478
and may be taken only once for credit.