ECE 514 Microsystem Integration and Packaging

Introduction to integrated circuit packaging and microelectronics system integration; signal integrity; electrical, mechanical, and thermal aspects of microsystem package simulation and design; electronics packaging materials; microsystem reliability and failure mechanisms; current technology developments. Also offered for undergraduate-level credit as ECE 414 and may be taken only once for credit.

Credits

4

Prerequisite

Prerequisites: senior or graduate standing in ECE.